A vulnerability was found in Qualcomm 835 Mobile PC Platform, 855 Mobile Platform, 855+, 860 Mobile Platform SM8150-AC, 865 5G Mobile Platform, 865+ 5G Mobile Platform SM8250-AB, 870 5G Mobile Platform SM8250-AC, AQT1000, FastConnect 6200, FastConnect 6800, FastConnect 6900, QCA6310, QCA6320, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6574AU, QCA6595AU, QCA6696, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD835, SD855, SD865 5G, SW5100, SW5100P, SXR2130, W5+ Gen 1 Wearable Platform, WCD9335, WCD9340, WCD9341, WCD9380, WCN3610, WCN3660B, WCN3680B, WCN3980, WCN3988, WCN3990, Wear 4100+ Platform, WSA8810, WSA8815, WSA8830, WSA8835, X55 5G Modem-RF System and XR2 5G Platform and classified as critical. Affected by this issue is some unknown functionality of the component Radio Interface Layer. The manipulation leads to memory corruption.

This vulnerability is handled as CVE-2023-21634. An attack has to be approached locally. There is no exploit available.

It is recommended to upgrade the affected component.